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Thermaltake CTE C700 TG ARGB Mid-Tower Case fits E-ATX with TG Snow (CA-1X7-00F6WN-01)

5,990.-
est. delivery in 2-4 days
Key Specifications

  • fits E-ATX Motherboards

  • Max CPU Cooler Height 190mm

  • 7 x 3.5" / 6 x 2.5"

  • Up to 420mm Radiator

  • Up to 410mm GPU Length

  • Up to 220mm PSU Length

  • 3 x 140mm CT140 ARGB Fans

  • 90-degree rotation of the motherboard

Color: Snow

SKU:#069502 Warranty2 Years by Thermaltake Product No.:CA-1X7-00F6WN-01 Short link:http://i.nvade.it/i50 See specifications from the manufacturer

The CTE C700 TG ARGB, a specially designed E-ATX mid tower chassis from the new CTE form factor series, was engineered to provide optimal thermal efficiency to ensure that critical components of your build are provided with adequate cooling. To achieve this the CTE C700 TG ARGB can support up to a 420mm AIO radiator not only at the front but also at the rear of the chassis. Three 140mm CT140 ARGB fans are pre-installed.
CTE Form Factor Designed by Thermaltake,/b> The CTE Form Factor Designed by Thermaltake, stands for Centralized Thermal Efficiency, and is focused around providing high level thermal performance to critical components. The design utilizes a 90-degree rotation of the motherboard providing more efficient airflow pathways.
Since the CPU location has been moved much closer to the front panel and the graphics card moved closer towards the rear panel, independent cold air induction is given for thermal dissipation of the CPU and graphics card respectively. This overall approach has allowed CTE to provide better and more efficient intake airflow through the placement of main components and cooling, as well as optimization to heat extraction from the system.

The CTE C700 is a new model of the CTE form factor series, which utilizes Centralized Thermal Efficiency and focuses on providing high levels of thermal performance to critical components.

The design utilizes a 90-degree rotation of the motherboard providing more efficient airflow pathways.
Move Critical Heat Sources (CPU And Graphic Cards) Closer Towards Cool Air Since the CPU location of the CTE C700 has been moved much closer to the front panel and the graphics card moved closer towards the rear panel, independent cold air induction is given for thermal dissipation of the CPU and graphics card respectively.

Installments
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1.16%
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Pay monthly 668.-
0.74%
10 m.
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0.74%
10 m.
Pay monthly 643.-
0.74%
10 m.
Pay monthly 643.-
0.74%
10 m.
Pay monthly 643.-
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